MEMS 2023 | 15-19 January 2023 | Munich, Germany

About » Program Committee

Executive Technical Program Committee

Taeko Ando
Ritsumeikan University
JAPAN

Cédric Ayela
CNRS
FRANCE

Nuria Barniol
Universitat Autonoma de Barcelona
SPAIN

Sarah Bedair
US Army Research Laboratory
USA

Cristian Cassella
Northeastern University
USA

Eric Chiou
University of California at Los Angeles
USA

Caroline Coutier
CEA-Leti
FRANCE

Philip Feng
University of Florida
USA

Irene Fernandez-Cuesta
University of Hamburg
GERMANY

Frank Goldschmidtboeing
University Freiburg
GERMANY

Songbin Gong
University of Illinois
USA

Nicole Hashemi
Iowa State University
USA

Fatimah Ibrahim
University Malaya
MALAYSIA

Nathan Jackson
University of New Mexico, USA

Michael Kraft
KU Leuven
BELGIUM

Franz Laermer
Robert Bosch GmbH
GERMANY

Hyunjoo Jenny Lee
KAIST
KOREA (ROK)

Thierry Leichle
CNRS
USA

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Wen Li
Michigan State University
USA

Zhihong Li
Peking University
CHINA

Andreu Llobera
Silicon Austria Labs
AUSTRIA

Ruochen Lu
The University of Texas at Austin
USA

Michel Maharbiz
UC Berkeley / iota Biosciences
USA

Jianmin Miao
Shanghai Jiaotong University
CHINA

Hiroshi Miyajima
Sumitomo Precision Products Co.,Ltd.
JAPAN

Mina Rais-Zadeh
NASA JPL
USA

Niclas Roxhed
KTH Royal Institute of Technology
SWEDEN

Jose-Luis Sanchez-Rojas
Universidad de Castilla - La Mancha
SPAIN

Hamed Sattari
CSEM
SWITZERLAND

Takaaki Suzuki
Gunma University
JAPAN

Massood Tabib-Azar
University of Utah
USA

Shuji Tanaka
Tohoku University
JAPAN

Sindy Tang
Stanford University
USA

Jaume Verd
University of the Balearic Islands
SPAIN

Guillermo Villanueva
EPFL
SWITZERLAND

Sandra Vos
NXP
USA

Fei Wang
SUSTech
CHINA

Dana Weinstein
Purdue University
USA

Anders Wolff
Technical University of Denmark DTU
DENMARK

Guoqiang Wu
Wuhan University
CHINA

Yao-Joe Yang
National Taiwan University
TAIWAN

Shinya Yoshida
Shibaura Institute of Technology
JAPAN

Roland Zengerle
Hahn-Schickard & Univ. of Freiburg
GERMANY

Siyang Zheng
Carnegie Mellon University
USA

Rong Zhu
Tsinghua University
CHINA

Yao Zhu
Institute of Microelectronics, A*STAR
SINGAPORE